Printed circuit boards
US8492898B2 · kind B2 · utility
0Cited by
52References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2008 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Feb 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.