Semblant Global Limited
3Patents
3Active
3Granted
41Portfolio score
Filing activity: Feb 18, 2008 → Jul 22, 2013 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8618420B2 | Apparatus with a wire bond and method of forming the same | Electricity | 5 | Active |
| US8492898B2 | Printed circuit boards | Electricity | 0 | Active |
| US9648720B2 | Method for manufacturing printed circuit boards | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.