Light emitting diode package
US8492912B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2009 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Aug 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a light emitting diode package, including a package body including a recess portion having a housing space and a lead frame mounted on the recess portion to be exposed; a light emitting diode chip mounted to be electrically connected to the lead frame; and a position indicator formed on the lead frame and guiding the mounting position of the light emitting diode chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.