Ultrasonic sensor
US8492954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Dec 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/302
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.