Patent · US Active

Metalized printhead substrate overmolded with plastic

US8496317B2 · kind B2 · utility

18Cited by

6References

20Claims

0Family size

Assignee

EASTMAN KODAK COMPANY · US

Inventors

Mario J. Ciminelli · Rochester, US
Eric A. Merz · Palmyra, US
Dwight J. Petruchik · Honeoye Falls, US

Key dates

Filing date	Aug 11, 2009
Grant date	Jul 30, 2013
Priority date	—
Expiry date	Jun 3, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2202/20
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.