Method of manufacturing multilayer ceramic substrates
US8496770B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 26, 2010 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | May 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.