System for separating a diced semiconductor die from a die attach tape
US8499813B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Feb 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.