Method for aligning wafers within wafer processing equipment
US8500916B2 · kind B2 · utility
0Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2004 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Apr 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Systems and methods for aligning wafers within wafer processing equipment. In a first embodiment, a wafer alignment nozzle comprises a fixed cylindrical member. A moveable cylindrical member is disposed with the fixed cylindrical member in a sliding fit. The moveable cylindrical member comprises a plurality of angled fluid orifices for directing a plurality of streams of the fluid onto a surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.