Patent · US Active

Methods of inspecting and manufacturing semiconductor wafers

US8501503B2 · kind B2 · utility

0Cited by

1References

32Claims

0Family size

Assignee

Nanda Technologies GmbH · DE

Inventors

Lars Markwort · Haimhausen, DE
Pierre-Yves Guittet · Veldhoven, NL

Key dates

Filing date	Apr 26, 2012
Grant date	Aug 6, 2013
Priority date	—
Expiry date	Apr 26, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/21
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.