Layer assembly

US8502197B2 · kind B2 · utility

Assignee

• TECHNISCHE UNIVERSITÄT BERLIN · DE

Inventors

• Andre Strittmatter · Magdeburg, DE
• Andrei Schliwa · Storkow, DE
• Tim David Germann · Berlin, DE
• Udo W. Pohl · Hofheim, DE
• Vladimir Gaysler · Novosibirsk, RU
• Jan-Hindrik Schulze · Berlin, DE

Key dates

• Filing date: Dec 11, 2012
• Grant date: Aug 6, 2013
• Expiry date: Dec 11, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/773
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A device including a locally modified buried first layer. A second layer is arranged on top of the first layer. The first layer includes at least one modified section and at least one unmodified section. The modified material of the locally modified buried first layer changes or induces mechanical strain in a portion of the second layer which is arranged above the at least one modified section. At least one nanostructure is placed on top of the second layer in an area, which is located above the at least one unmodified section of the first layer or adjacent thereto, said at least one nanostructure being formed by a strain-sensitive third material deposited on the locally strained second layer.