Methods and apparatuses to stiffen integrated circuit package
US8502400B2 · kind B2 · utility
2Cited by
19References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2012 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Mar 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.