Integrated circuit package with multiple dies and interrupt processing
US8504751B2 · kind B2 · utility
3Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2010 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Mar 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die. The dies are connected to each other through an interface. The package includes interrupt processing for detecting interrupt information and providing a packet in response to the interrupt information detection. The packet includes an address to which data in the packet is to be written. The interface is configured to transport the packet between the dies. A data store is provided to which the data is writable. An interrupt event is determined from data received in several packets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.