Metal coating, forming method thereof, and metal wiring
US8507104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2006 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Jul 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 μm. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.