Methods of forming electronic devices
US8507185B2 · kind B2 · utility
5Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Dec 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.