Patent · US Active

Method to form solder deposits on substrates

US8507376B2 · kind B2 · utility

9Cited by

1References

18Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Ingo Ewert · Berlin, DE
Sven Lamprecht · Berlin, DE
Kai-Jens Matejat · Berlin, DE
Thomas Pliet · Berlin, DE

Key dates

Filing date	Oct 7, 2009
Grant date	Aug 13, 2013
Priority date	—
Expiry date	Jul 28, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/054
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.