Thomas Pliet
4Patents
2h-index
11Co-inventors
41Inventor score
Filing activity: Aug 30, 2005 → May 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8679316B2 | Aqueous, acid bath and method for the electrolytic deposition of copper | Electricity | 22 | Active |
| US8507376B2 | Method to form solder deposits on substrates | Electricity | 9 | Active |
| US9445510B2 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Electricity | 1 | Active |
| US9526183B2 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.