Adhesive composition, adhesive film and wiring film using the same
US8507592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2011 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/29
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.