Cooling active circuits
US8508943B2 · kind B2 · utility
3Cited by
80References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0087
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.