Paul A. Danello
4Patents
3h-index
11Co-inventors
47Inventor score
Filing activity: Feb 7, 2002 → Mar 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8780561B2 | Conduction cooling of multi-channel flip chip based panel array circuits | Emerging Cross-Sectional Technologies | 23 | Active |
| US6615997B2 | Wedgelock system | Electricity | 9 | Expired |
| US8508943B2 | Cooling active circuits | Electricity | 3 | Active |
| US11171101B2 | Process for removing bond film from cavities in printed circuit boards | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.