Fabrication method for surrounding gate silicon nanowire transistor with air as spacers
US8513067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2011 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/43
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention discloses a fabrication method for a surrounding gate silicon nanowire transistor with air as spacers. The method comprises: performing isolation, and depositing a material A which has a higher etch selectivity ratio with respect to Si; performing photolithography to define a Fin hard mask; etching the material A to form the Fin hard mask; performing source and drain implantation; performing photolithography to define a channel region and large source/drain regions; forming the Si Fin and the large source/drains; removing the hard mask of the material A; forming a nanowire; etching the SiO2 to form a floating nanowire; forming a gate oxide layer; depositing a polysilicon; performing polysilicon injection; performing annealing to activate dopants; etching the polysilicon; depositing SiN; performing photolithography to define a gate pattern; etching the SiN and the polysilicon to form the gate pattern; separating the gate and the source/drain with a space in between filled with air; depositing SiO2 to form air sidewalls; performing annealing to densify the SiO2 layer; using subsequent processes to complete the device fabrication. The invention is compatible with the CMO…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.