Manufacturing a microelectronic device comprising silicon and germanium nanowires integrated on a same substrate
US8513125B2 · kind B2 · utility
18Cited by
6References
15Claims
0Family size
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Key dates
| Filing date | Aug 30, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | May 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a device comprising a structure with nanowires based on a semiconducting material such as Si and another structure with nanowires based on another semiconducting material such as SiGe, and is notably applied to the manufacturing of transistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.