Package carrier and manufacturing method thereof
US8513530B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is provided. A first adhesive layer is formed on the first surface of the substrate. The first adhesive layer and the substrate define a notch. A thermal-conductive element is configured in the notch and fixed into the notch via the first adhesive layer. A second adhesive layer and a metal layer located on the second adhesive layer are formed on the second surface of the substrate. The metal layer is connected to a bottom surface of the thermal-conductive element. The thermal-conductive element is located between the metal layer and the first adhesive layer. The first adhesive layer is removed to expose the first surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.