Patent · US Active

Signal repowering chip for 3-dimensional integrated circuit

US8513663B2 · kind B2 · utility

1Cited by

1References

5Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Markus Buehler · Holzgerlingen, DE
Sebastian Ehrenreich · Sonneberg, DE
Juergen Koehl · Holzgerlingen, DE

Key dates

Filing date	Apr 5, 2010
Grant date	Aug 20, 2013
Priority date	—
Expiry date	Dec 31, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A signal repowering chip comprises an input; at least one inverter connected in series to the input; and at least one switch connected to a test enable signal, the at least one switch configured to allow a signal connected to the input to propagate through the at least one inverter in the event that the test enable signal is on. A 3-dimensional integrated circuit comprises a first chip, the first chip comprising a default voltage level and a plurality of wiring layers; and a second chip, the second chip comprising at least one repeater, the repeater being connected to the default voltage level.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.