Lateral thermal dissipation LED and fabrication method thereof
US8513696B2 · kind B2 · utility
1Cited by
5References
9Claims
0Family size
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Key dates
| Filing date | Mar 4, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | May 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A lateral thermal dissipation LED and a fabrication method thereof are provided. The lateral thermal dissipation LED utilizes a patterned metal layer and a lateral heat spreading layer to transfer heat out of the LED. The thermal dissipation efficiency of the LED is increased, and the lighting emitting efficiency is accordingly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.