Semiconductor device
US8513778B2 · kind B2 · utility
15Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 22, 2009 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | May 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05554
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semiconductor device that is capable of preventing impurities such as moisture from being introduced into an active region at the time of dicing and at the time of bonding and that is capable of being easily miniaturized. The semiconductor device includes a cylindrical dummy wire having an opening for allowing a wire interconnecting a semiconductor element and an external connection terminal to pass therethrough, extending in an insulation film provided on a semiconductor layer having the semiconductor element to surround the semiconductor element, and disposed inside the external connection terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.