Power semiconductor module including substrates spaced from each other

US8514579B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thilo Stolze · Arnsberg, DE
• Olaf Hohlfeld · Warstein, DE
• Peter Kanschat · Soest, DE

Key dates

• Filing date: May 10, 2010
• Grant date: Aug 20, 2013
• Expiry date: Sep 3, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.