Patent · US Active

Cover for microsystems and method for producing a cover

US8517545B2 · kind B2 · utility

2Cited by

5References

48Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Hans-Joachim Quenzer · Berlin, DE
Marten Oldsen · Kleve, DE
Ulrich Hofmann · Itzehoe, DE

Key dates

Filing date	Feb 13, 2009
Grant date	Aug 27, 2013
Priority date	—
Expiry date	Mar 1, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24355
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.