Method of treating a gas stream
US8518162B2 · kind B2 · utility
15Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2006 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Sep 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02C20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method is described for treating gas exhaust from a polysilicon etch process, which uses a plasma abatement device to treat the gas. The device comprises a stainless steel gas chamber having a gas inlet for receiving the gas and a gas outlet. As the gas may contain a halocompound and water vapor, the chamber is heated to a temperature that inhibits adsorption of water on the surface within the chamber, thereby inhibiting corrosion of the gas chamber. The gas is then conveyed to the gas chamber for treatment, and the temperature of the chamber is maintained above said temperature during treatment of the gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.