Semiconductor devices and methods of forming thereof
US8518794B2 · kind B2 · utility
1Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Jan 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/411
Abstract
Provided is a semiconductor device. The semiconductor device includes: a substrate; an active layer on the substrate; a capping layer on the active layer; source/drain electrodes on the capping layer; a gate electrode on the active layer; and a first void region on a first sidewall of the gate electrode and a second void region on a second sidewall facing the first sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.