Circuit board and manufacturing method thereof
US8519270B2 · kind B2 · utility
25Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 19, 2010 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Aug 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.