Semiconductor chip, and semiconductor package and system each including the semiconductor chip
US8519470B2 · kind B2 · utility
4Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2011 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | May 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a redistribution interconnect that is implemented by shorting bumps, and a semiconductor package and a system each including the semiconductor chip. The semiconductor chip includes a semiconductor substrate, a passivation film disposed on the semiconductor substrate, and a plurality of pseudo bumps disposed on the passivation film. Each pseudo bump is directly connected to adjacent pseudo bumps to form at least one redistribution interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.