Integrated millimeter wave antenna and transceiver on a substrate
US8519892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2012 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Jun 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q19/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.