Patent · US Active

Integrated circuit (IC) test probe

US8525168B2 · kind B2 · utility

4Cited by

25References

25Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Bing Dang · Chappaqua, US
John U. Knickerbocker · Wappingers Falls, US
Yang Liu · Shanghai, CN

Key dates

Filing date	Jul 11, 2011
Grant date	Sep 3, 2013
Priority date	—
Expiry date	Aug 30, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A test probe head for probing integrated circuit (IC) chips and method of making test heads. The test head includes an array of vias (e.g., annular vias or grouped rectangular vias) through, and exiting one surface of, a semiconductor layer, e.g., a silicon layer. The vias, individual test probe tips, may be on a pitch at or less than fifty microns (50 μm). The probe tips may be stiffened with SiO2 (and optionally silicon) extending along the sidewalls. A redistribution layer connects individual test probe tips externally. The probe tips may be capped with a hardening cap that also caps stiffening SiO2 and silicon along the tip sidewall.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.