Leadframe package for high-speed data rate applications
US8525310B2 · kind B2 · utility
2Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2011 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.