Semiconductor device, electronic apparatus and semiconductor device fabricating method
US8525355B2 · kind B2 · utility
1Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2007 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Sep 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor device which includes a primary semiconductor chip 11, a secondary semiconductor chip 12 stacked on the primary semiconductor chip 11, primary external connecting terminals 16 which are electrically connected with the primary semiconductor chip 11 via wires 21, secondary external connecting terminals 17 which are electrically connected with the secondary semiconductor chip 12 via wires 22 and primary and secondary low-elasticity resins 13, 15 which seal the primary and secondary semiconductor chips 11, 12 in such a manner as to cover them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.