Toshio Gomyo
4Patents
2h-index
7Co-inventors
33Inventor score
Filing activity: Mar 28, 2005 → Oct 25, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7279771B2 | Wiring board mounting a capacitor | Emerging Cross-Sectional Technologies | 50 | Expired |
| US7843059B2 | Electronic parts packaging structure | Emerging Cross-Sectional Technologies | 15 | Active |
| US8525355B2 | Semiconductor device, electronic apparatus and semiconductor device fabricating method | Electricity | 1 | Active |
| US8402644B2 | Method of manufacturing an electronic parts packaging structure | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.