Inspection apparatus and inspection method
US8525984B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2012 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | May 10, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95615
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.