Dissection splitting with optical proximity correction to reduce corner rounding
US8527916B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides one embodiment of an integrated circuit (IC) method. The method includes receiving an IC design layout having an main feature, the main feature including two corners and an edge spanning between the two corners; performing a feature adjustment to the edge; performing a dissection to the edge such that the edge is divided to include two corner segments and one center segment between the two corner segments; performing a first optical proximity correction (OPC) to the main feature for a center target associated with the center segment; thereafter, performing a second OPC to the main feature for two corner targets associated with the corner segments; and thereafter, performing a third OPC to main feature for the center target, resulting in a modified design layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.