Method and apparatus for performing pattern reconnection after individual or multipart alignment

US8530120B2 · kind B2 · utility

Assignee

• MICRONIC MYDATA AB · SE

Inventors

• Mikael Wahlsten · Stockholm, SE
• Per Gustafsson · Bjärred, SE

Key dates

• Filing date: Feb 28, 2011
• Grant date: Sep 10, 2013
• Expiry date: May 9, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/4679
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of correspon…