Integrated circuit die, an integrated circuit package and a method for connecting an integrated circuit die to an external device
US8531197B2 · kind B2 · utility
2Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31715
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit die comprises an electronic circuit and one or more output ports for outputting signals from the die via an external impedance, to a load, external from the die. The output port is connected to the electronic circuit. The die is further provided with an on-die sampling oscilloscope circuit connected to the output port, for measuring a waveform of the outputted signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.