Patent · US Active

Analysis of an auxiliary leveler additive in an acid copper plating bath

US8535504B2 · kind B2 · utility

1Cited by

1References

15Claims

0Family size

Assignee

ECI TECHNOLOGY, INC.

Inventors

Michael Pavlov · Kingston, US
Eugene Shalyt · Hackettstown, US
Peter Bratin · Great Neck, US
Isaak Tsimberg · Brooklyn, US

Key dates

Filing date	Apr 2, 2011
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Dec 14, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/48
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.