Thermally cured underlayer for lithographic application
US8535872B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Mar 21, 2012 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Mar 21, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/094
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.