Patent · US Active

Method of manufacturing a semiconductor device

US8535983B2 · kind B2 · utility

5Cited by

2References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Tze Yang Hin · Cupertino, US
Stefan Martens · Witzenhausen, DE
Werner Simbuerger · Haar, DE
Helmut Wietschorke · Laberweinting, DE
Horst Theuss · Wenzenbach, DE
Beng Keh See · Melaka City, MY
Ulrich Krumbein · Rosenheim, DE

Key dates

Filing date	Jun 2, 2011
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Jul 5, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.