Patent · US Active

Electronic modules and methods for forming the same

US8535984B2 · kind B2 · utility

9Cited by
114References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 2011
Grant dateSep 17, 2013
Priority date—
Expiry dateAug 31, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19043
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.