Semipolar semiconductor crystal and method for manufacturing the same
US8536030B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Mar 15, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B29/403
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a semipolar semiconductor crystal comprising a group-III-nitride (III-N), the method comprising: providing a substrate comprising sapphire (Al2O3) having a first surface that intersects c-planes of the sapphire; forming a plurality of trenches in the first surface, each trench having a wall whose surface is substantially parallel to a c-plane of the substrate; epitaxially growing a group-III-nitride (III-N) material in the trenches on the c-plane surfaces of their walls until the material overgrows the trenches to form a second planar surface, substantially parallel to a (20-2l) crystallographic plane of the group-III-nitride, wherein l is an integer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.