Protecting bond pad for subsequent processing
US8536044B2 · kind B2 · utility
4Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Dec 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for opening a bond pad on a semiconductor device is provided. The method comprises removing a first layer to expose a first portion of the bond pad and forming a protective layer over the exposed first portion of the bond pad. The method further comprises performing subsequent processing of the semiconductor device and removing the protective layer to expose a second portion of the bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.