Patent · US Active

Method for forming metal contacts

US8536049B2 · kind B2 · utility

2Cited by

3References

13Claims

0Family size

Assignees

Inventors

Erik Reddington · Ashland, US
Thomas C. Sutter · Holden, US
Lujia Bu · Shrewsbury, US
Alexandra Cannon · Framingham, US
Susan E. HABAS · Boulder, US
Calvin J. Curtis · Lakewood, US
Alexander Miedaner · Boulder, US
David S. Ginley · Evergreen, US
Marinus Franciscus Antonius Maria van Hest · Lakewood, US

Key dates

Filing date	Oct 14, 2011
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Nov 15, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.