Equipment and methods for etching of MEMS

US8536059B2 · kind B2 · utility

Assignee

• QUALCOMM MEMS Technologies, Inc. · US

Inventors

• Khurshid Syed Alam · Mountain View, US
• Evgeni Gousev · Saratoga, US
• Marc Mignard · San Jose, US
• David Heald · Solvang, US
• Ana R. Londergan · Santa Clara, US
• Philip D. Floyd · Redwood City, US

Key dates

• Filing date: Feb 18, 2008
• Grant date: Sep 17, 2013
• Expiry date: Aug 9, 2029

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/047
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.