Optical package and related methods
US8538215B2 · kind B2 · utility
6Cited by
4References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Sep 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for an electronic chip including an optical component protects the chip and the component, while allowing for an optical connection of the component with another optical device. This is achieved, in various embodiments, by forming a well in a protective material deposited over the chip to expose the optical component, and by providing alignment features in the protective material to align and connect the optical component with another optical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.