Film forming apparatus, film forming method and storage medium
US8539908B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2008 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Nov 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes a processing chamber, and a mounting table disposed in the processing chamber to mount a substrate thereon. The film forming apparatus further includes a gas shower head having gas supply holes and including a central region facing a central portion of the substrate and a peripheral region facing a peripheral portion of the substrate, a first processing gas supply unit for supplying a first processing gas to the central region, a second processing gas supply unit for supplying a second processing gas to the central region, an energy supply unit for supplying energy to react the first processing gas with the second processing gas on the substrate, and a purge gas supply unit for supplying a purge gas to the central region and the peripheral region when one of the first and the second processing gas is switched by the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.